The AMS SW3300 and AMS SW3300A The SurfaceWave Family of Products The SW3300 offers: Metrology for mixed 200/300 or 150/200 mm wafers Superior measurement of bottle trench, straight trench, dielectric layer thickness and composition Exacting measurements at the 110 nm node and below Dual load port configurable as: Dual FOUP Dual SMIF FOUP & SMIF bridge tool Open cassette SEMI S2/S8 and CE compliant Fed 209E Class 1 mini-environment (ISO Class 2) 300mm GEM automation standards. Throughput: Up to 75 wafers/hour 55 wafers/hour, at 5 sites with pattern recognition Features: Robust, solid-state lasers with lifetime greater than 1 year Precise and repeatable pattern measurement Lowest ownership cost of any non-contact system on the market Easy to use Proven track record of reliability AMS quality and durability AMS SW3300A The advanced SW 3300A was announced mid-year 2007. It contains the same features as the SW 3300, and adds multiple layer measurements. A full product brochure may be downloaded here.