The IR 3100 Family of Products Model Based Infrared Reflectance Technology The IR3100 offers: Metrology for mixed 200/300 or 150/200 mm wafers Superior measurement of bottle trench, straight trench, dielectric layer thickness and composition Exacting measurements at the 110 nm node and below Dual load port configurable as: Dual FOUP Dual SMIF FOUP & SMIF bridge tool Open cassette SEMI S2/S8 and CE compliant Fed 209E Class 1 mini-environment (ISO Class 2) 300mm GEM automation standards. Throughput: Up to 75 wafers/hour 60 wafers/hour, at 5 sites with pattern recognition Features: Robust, solid-state lasers with lifetime greater than 1 year Precise and repeatable pattern measurement Lowest ownership cost of any non-contact system on the market Easy to use Proven track record of reliability AMS quality and durability IR3100N The IR3100N was announced mid-year 2007.  It contains the same features as the IR3100, with an extended wavelength range to include the mid-infrared and near-infrared spectral ranges.  The additional wavelength capability allows the tool to measure shallower structures than was previously possible with existing IR systems.  A full product brochure may be downloaded here. IR3100S The IR3100S was announced mid-year 2007 for shipment at the end of the year.  It contains the same features as the IR3100, but contains a smaller spot size of 70 by 70 microns without sacrificing signal to noise or data acquisition time.  The IR3100S allows product wafer measurements within the scribe line for composition measurements such as BPSG.  A full product brochure may be downloaded here.