An Outstanding Platform Every AMS metrology tool has a common platform - our patented high-throughput, non-contact, non-destructive inline automatic wafer handling system that eliminates the need for the expensive and time-consuming process of traditional visual inspections with scanning electron microscopes. With its small footprint, the platform supports both 200 mm and 300 mm wafers, and fits perfectly in any fab. AMS tools operate at production-level speeds of up to 75 wafers per hour, depending upon the number of pattern recognition sites. The speed of the platform has increased xx percent in just the last 12 months, as AMS engineers continually improve the wafer handling capacity, providing an optimal balance between speed and sensitivity. The data derived from the tool is looped right back to fab process engineers on site, who oversee quality issues and make APC adjustments as the production run continues. The IR3100 Family of Products Model Based Infrared Reflectance Technology The AMS IR family of products uses proprietary model-based infrared reflectometry to measure thickness, depth and parameters of etched and recess filled trench structures with nanometer precision. It can also measure epitaxial layer thickness with angstrom precision even at 30 nm and below. Our most advanced and flexible MBIR metrology tool is the IR3100. This product uses our latest MBIR technology to deliver high-throughput, non-contact, non-destructive measurements of dielectric layers and etch structures including straight and bottle trench. The IR3100 is capable of incredible speed and accuracy at the 65 nm node and lower for maximum scalability and the lowest cost of ownership in its class. Click to learn about the IR3100, IR3100N & IR3100S AMS 3300 SurfaceWave technology The AMS 3300 uses the exclusive SurfaceWave™ technology to measure the thickness and uniformity of thin film metals and dielectrics. It’s a low cost but powerful product built expressly for copper, low k materials. The 3300 delivers high-throughput, non-contact, non-destructive measurements of the thickness and uniformity of metal line arrays and pads for all copper/low-k processes. The 3300 is capable of incredible speed and accuracy at the 65 nm node and lower for maximum scalability and the lowest cost of ownership in its class. Click to learn about the AMS SW3300 & the SW3300A