| 07/11/2006 |
| AMS offers Proven Metrology Solution for Deep Trench DRAM Metrology |
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IR3000 Provides Tapered Deep Trench, Photo-resist and Polysilicon Recess Measurements to Increase Efficiency and Yield
NATICK, Mass. – July 11, 2006
Royal Philips Electronics (NYSE: PHG) today announced that its metrology business unit, Philips Advanced Metrology Systems (Philips AMS) and its IR3000 metrology solution can address numerous deep trench application challenges for DRAM manufacturing. The IR3000, a Model-based Infrared Reflectance (MBIR ä ) metrology solution, allows deep trench DRAM manufacturers to increase efficiency and yield for existing and new processes at 110nm, 90nm and beyond. The tool is deployed at multiple fabs worldwide for applications including tapered deep trench, photo-resist and polysilicon recess measurements.
New generations of integrated circuit devices include more vertical features to accommodate shrinking geometries. This creates a demand for new in-line automated metrologies for vertical structure measurement. For example, in deep trench DRAM, vertical structure control is very important due to the high aspect ratio features and the complexities of current device design. The Philips AMS IR3000 has proven to be a powerful tool for addressing these new challenges and for in-line monitoring of these vertical structures. “Traditional metrology solutions such as SEM, AFM, and others can no longer meet the needs of DRAM manufacturers because they are destructive, slow and costly,” said Chris Moore, general manager for Philips AMS. “Philips AMS has worked with many DRAM customers to develop applications using the IR3000 that meet their expanding process needs while offering them fast measurements. Our solution allows them to quickly identify defects and make the appropriate process changes which immediately improve their bottom line.”
Tapered Deep Trench Measurements
The IR3000 is currently being used for multiple applications including tapered deep trench where DRAM manufacturers need to measure the area of the etched structure. The resulting measurements help provide earlier detection of etch defects such as choking, in which trenches over-etch and become merged together. The IR3000 can also be used to identify other deep trench process defects such as undercut and mask erosion and for the detection of wet bottle etch and poly etch uniformity problems. With advanced detection, a manufacturer can make adjustments to its tools or process to further increase yield and efficiency.
Poly and Photo-resist Recess Measurements
In DRAM manufacturing, once a trench has been etched it is then filled with polysilicon and requires poly and/or photo-resist recess measurements. During the different stages of recess fill and etching, it is essential that manufacturers have accurate and repeatable measurements. The Philips AMS IR3000 can perform measurements of either photo-resist or polysilicon recess structures. Poly recess is measured at various depths corresponding to the recess one, two or three process steps. These measurements provide a cost-effective alternative to SEM and AFM, allowing faster measurements and more detailed uniformity monitoring. Such detailed monitoring improves fab efficiency, by allowing engineers to target lots for rework if needed and by highlighting potential process tool issues before they become severe. This helps identify problems with the previous process step which manufacturers can then correct to further increase yield.
“These applications have resulted in yield improvements and enhanced productivity for our customers,” commented Moore. “It validates that the high throughput, non-contact nature of the Philips AMS metrology allows more process control at a lower cost of ownership compared to historical techniques.”
Philips AMS IR3000 uses proprietary Model-based Infrared Reflectometry to measure thickness, depth, and parameters of etched and recess-filled trench structures with nanometer precision. It can also measure epitaxial layer thickness with high precision even at 30nm and below. The IR3000 has excellent repeatability and stability essential for in-line monitoring tools and has a throughput of 45wph (5 sites with pattern recognition). It is ideal for a number of process applications ranging from high-aspect ratio trench depth to bottle trench measurement as well as dielectric layer thickness and composition, epitaxial and SOI layer thickness and low-k composition.
About Royal Philips Electronics
Royal Philips Electronics of the Netherlands (NYSE: PHG, AEX: PHI) is one of the world's biggest electronics companies and Europe's largest, with sales of EUR 30.4 billion in 2005. With activities in the three interlocking domains of healthcare, lifestyle and technology and 161,500 employees in more than 60 countries, it has market leadership positions in medical diagnostic imaging and patient monitoring, color television sets, electric shavers, lighting and silicon system solutions.
News from Philips is located at www.philips.com/newscenter
Contact: Steve Kohnle
AMS
(508) 647-1149
steve.kohnle@advancedmetrologysystems.com
Contact: Alicia Libucha
Lois Paul & Partners, LLC
(781) 782-5703
alicia_libucha@lpp.com
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